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2006-01-28T00:00:00.000Z

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Wrong Shyam Murarka?

Dr. Shyam Murarka P.

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Background Information

Employment History

Director

Rensselaer's Center for Advanced Interconnect Science and Technology

Director

Rensselaer Polytechnic Institute

Director

Center for Advanced Interconnect Science and Technology

Director

Chartered Institute of Ecology and Environmental Management

L)Irector, Center for Advanced Interconnect Science and Technology - Professor, Materials Science and Engineering and Center Fi)R

Rensselacr Polytechnic Institute

Education

Ph.D. degree

Chemistry

Agra University , Agra , India ,

Ph.D. degree

Metallurgy and Materials Science

University of Minnesota , Minneapolis ,

Web References (14 Total References)


Member Benefits

www.ac-chamber.org [cached]

Dr. Shyam P. Murarka, director of Rensselaer's Center for Advanced Interconnect Science and Technology, said, "The FC marks a new chapter in industry/university partnerships that will create opportunities for high-technology firms and attract research and microelectronics manufacturers to New York.By looking well beyond our pioneering copper interconnect research, we will continue to supply the research and professional talent that provide the competitive edge for the information technology industry."

"Our microfabrication clean room facilities allow us to jointly develop technology and processes with industry, while our New York State sponsored collaborative effort with the University at Albany, Hudson Valley Community College, and Rochester Institute of Technology offers the just-in-time skills training to implement the results of the FC," Dr. Murarka said.


Dr. Shyam P. Murarka, ...

www.seminy.com [cached]

Dr. Shyam P. Murarka, director of Rensselaer's Center for Advanced Interconnect Science and Technology, said, "The FC marks a new chapter in industry/university partnerships that will create opportunities for high technology firms and attract research and microelectronics manufacturers to New York.By looking well beyond our pioneering copper interconnect research, we will continue to supply the research and professional talent that provide the competitive edge for the information technology industry."

"Our microfabrication clean room facilities allow us to jointly develop technology and processes with industry, while our New York State sponsored collaborative effort with the University at Albany, Hudson Valley Community College, and Rochester Institute of Technology offers the just-in-time skills training to implement the results of the FC."


Chip Scale Review Online

www.chipscalereview.com [cached]

Dr. Shyam Murarka, Rensselaer Polytechnic Institute, received $1.43 million to develop high-performance interconnect systems for submicron ICs. [src.org]


Albany NanoTech Nanotechnology Research Facilities and Programs

www.albanynanotech.org [cached]

Shyam Murarka, director of RPI's Center for Advanced Interconnect Science and Technology, is chairman of the New York academic advisory council.


semiconbay home page

www.semiconbay.com [cached]

Dr. Shyam Murarka, Professor, Rensselaer Polytechnic Institute, USAsemiconbay home page

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Dr. Shyam MurarkaRensselaer Polytechnic Institute, USA
SHYAM P. MURARKA is currently the Elaine S. and Jack S. Parker Chair in Engineering and a Professor in the Center for Integrated Electronics, Electronics Manufacturing and Electronic Media (CIEEM) and Materials Science and Engineering Department.He received the Ph.D. degree in Chemistry from Agra University, Agra, India, in 1970, and the Ph.D. degree in Metallurgy and Materials Science from the University of Minnesota, Minneapolis, also in 1970.
Prior to joining Rensselaer, from 1972 until August 1984, he had been with Bell Laboratories, Murray Hill, NJ, where he received a Distinguished Technical Staff Award (in 1992, the first time such awards were made) and was a Supervisor in the Materials Technology Department.He was Director of CIEEM from July 1994 until April 1996 and Co-Director of SEMATECH Center of Excellence at Rensselaer Polytechnic Institute from January 1990 until August 1996.He is a member of several professional societies and received the 1987 Thomas D. Callinan Award of the Electrochemical Society and became a fellow of American Society of Metals, International in 1991, of American Vacuum Society in 1993, of IEEE in 1995 and of ECS in 1997.Also, he has been a member of several nationwide panels (e.g., SIA NTRS Roadmap, NSF-New Paradigms for Manufacturing 1994, Micro Tech 2000, 1991, etc.) to discuss advanced technology issues in microelectronics.As a frequent contributor to technical publications in the field of Materials Science, he has published over 260 papers and given over 270 talks (about half invited) on the diffusion and defects in metals, oxides, and semiconductors ; thin films and thin film metallization of IC's and has written books, Silicides for VLSI Applications, (Academic Press, NY, 1983) ; Electronics Materials, Science and Technology with Dr. M. Peckerar (Academic Press, 1989), Metallization Theory and Practice for VLSI and ULSI, (Butterworth, 1993), Chemical Mechanical Planarization of Microelectronic Materials, (Wiley, 1997) with Drs. J. Steigerwald and R. Gutmann, and Copper : Fundamental Mechanisms for Microelectronic Applications, (Wiley, 2000) with Drs. I. V. Verner and R. J. Gutmann.He also has coedited three books on Advanced Metallization in Microelectronics, (MRS 1990, 1992, 1994), one on Interface Control of Electrical, Chemical, and Mechanical Properties, (MRS 1994), one on Microelectronics Technology and Process Integration, (SPIE, 1994), and one on Low Dielectric Constant Materials -Synthesis and Applications in Microelectronics (MRS, 1995), and one on Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits, (MRS, 1998), and written review chapters in several edited volumes (books).He is presently actively involved with graduate students working in the area of multilevel interconnections specifically high conductivity metals, low dielectric constant interlayer dielectric, and planarization.
He is a member of ASM International, The Electrochemical Society, IEEE, AVS, and MRS. He was also an Associate Editor of the Journal of Electrochemical Society and is frequent reviewer of the national and international journal articles.He has also coedited special journal issues covering the interconnection issues in semiconductors.

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