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Wrong Robert Patti?

Robert C. Patti

Chief Technology Officer

Tezzaron Semiconductor Corporation

HQ Phone:  (630) 505-0404

Direct Phone: (630) ***-****direct phone

Email: r***@***.com

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I agree to the Terms of Service and Privacy Policy. I understand that I will receive a subscription to ZoomInfo Community Edition at no charge in exchange for downloading and installing the ZoomInfo Contact Contributor utility which, among other features, involves sharing my business contacts as well as headers and signature blocks from emails that I receive.

Tezzaron Semiconductor Corporation

1415 Bond Street Suite 111

Naperville, Illinois,60563

United States

Company Description

Tezzaron® Semiconductor is the world leader in 3D-ICs. We specialize in 3D wafer stacking, TSV processes, and cutting edge memory products. In 2004 Tezzaron demonstrated the world's first successful wafer-stacked 3D-ICs with TSV, including microprocessors, s...more

Web References(176 Total References)


3D Test 2010 - Call for Participation

www.ieee-tttc.org [cached]

by Bob Patti, CTO of Tezzaron Semiconductor, USA
Bob Patti - Tezzaron Semiconductor, USA


Keynote Speeches at ISQED 2011

isqed.org [cached]

Robert Patti
Robert Patti Chief Technology Officer Tezzaron Semiconductor 3D integrated circuits are starting to make their way into the market place. The new technology offers great rewards in terms of power savings, density, and performance, but also carries new design and manufacturing challenges. The speaker will review various 3D integration technologies and discuss the current state of the art. He will also cover the impact on design and test. About Robert Patti Bob Patti is the Chief Technology Officer of Tezzaron Semiconductor Corporation, a leading force in 3D-IC technology. Tezzaron built its first working 3D-ICs in 2004 and now uses wafer-level stacking processes to create ultra high-density 3D memory products and other semiconductor sub-components. Before Tezzaron, Mr. Patti founded an R&D company specializing in high-performance systems and ASICs; he participated in the design of more than 100 chips over the course of 12 years. Mr. Patti received the SEMI Award for North America in 2009, served as Vice-Chairman of JEDEC's DDRIII / Future Memories Task Group, and holds 15 US patents, numerous foreign patents, and many more pending patent applications in deep sub-micron semiconductor chip technologies. He earned Bachelor of Science degrees in both physics and electrical engineering from Rose-Hulman Institute of Technology.


Insights From Leading Edge » Blog Archive » IFTLE 82 3DIC at the 2011 IEEE IEDM and other 3D and Adv Pkging topics

semimd.com [cached]

Tezzaron CTO Bob Patti commented: "Memory can now be integrated vertically rather than embedded in the logic die.


Insights From Leading Edge » Blog Archive » IFTLE 166 IEEE 3DIC Conf part 1; 3DIC panel discussion; Ginti; Novati

semimd.com [cached]

Bob Patti, CTO of Tezzaron which recently acquired the old Sematech fabs in Austin updated us on Tezzaron / Novati activities and Avi Bar-Cohen of DARPA brought us up to date on the DARPA ICECool programs.
Jan Vardaman of TechSearch moderated a panel entitled "Progress and Remaining Obstacles for 3D ICs and 2.5D HVM" which consisted of Bob Patti, CTO, Tezzaron, Prof Mitsumasa Koyanagi, Tohoku University; Dr Dimitrios Velenis, IMEC; Doug Anberg, Vice President, Ultratech (a stepper manufacturer) and Dr Dongkai Shangguan, CEO of the National Center for Advanced Packaging (NCAP) in China. When discussing imaging for interposers, Patti reported that interposers are by definition required to be quite large and are having trouble since current retical fields are i.e. 26 x 31mm. Patti indicated that Tezzaron / Novati avoids that issue by doing their thinning after F2F wafer bonding so the bottom wafer becomes the carrier and is not ever removed. All agreed that cost remains the number 1 obstacle to HVM and most agreed that improved yield and increased throughput were needed. The interposer discussion, as with most other conferences, centered around whether silicon, glass or laminate would be the best choice. Patti offered that glass while a useful interposer material would require a major infusion of capital to get it off the ground. During his invited presentation "A Perspective on Manufacturing 2.5/3D" CTO Bob Patti indicated that from his perspective vendors have become much more "3D aware." Dave Chapman and Bob Patti - Tezzaron Dave Chapman and Bob Patti - Tezzaron Patti reports their current capacity is 12K 300mm wafers/mo going to 26K by 2016. He announced that Novati will become a US trusted foundry later this year. Of special interest was Bobs remark that he sees future power conversion being done on the interposer. As an aside... Patti specifically called out new New Mexico process engineers Walter White and lab technician Jesse Pinkman as having been invaluable in both fund-raising and 3DIC process development.


Insights From Leading Edge » 2016 » December

semimd.com [cached]

The 7th annual IEEE 3DIC Conference took place in SF a few weeks ago chaired by Paul Franzon of NC State and Bob Patti of Tezzaron.


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