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Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the automotive, broadband, ce... more.
Corporate Vice President, Technology and Platform Development
Associate Professor In the Electronic Systems Department
Arizona State University
Vice President of New Package Engineering
Position, Electronics Packaging Industry
Honors Amkor Technology Executive
ECTC | IEEE Electronic Components and Technology Conference
Robert Darveaux - Skyworks Solutions, Inc.
The second keynote address was focused on Flip Chip & Wafer Level Packaging, "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies" by Dr. Robert Darveaux, Senior Vice President of Technology & Platform Development of Amkor Technology, Inc.
He discussed device trends driving IC package development today, among the most prevalent are:
A strong focus on packaging was also in evidence in 2011, with a session featuring John Waite (GLOBALFOUNDRIES), Raj Pendse (STATS ChipPAC), Robert Darveaux (Amkor), and Nick Yu (Qualcomm).
• Robert Darveaux presented "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs." Raj Pendse, VP of product and technology marketing at STATS ChipPAC and Robert Darveaux, CTO of Amkor, covered this supply chain integration from the dedicated packaging house perspective. Darveaux spoke on "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs." Darveaux compared the relative ease of sourcing, assembly, and test of package-on-package (POP) with the challenges of TSV: difficult to test high-density area array contact pads or bumps; bare or partially assembled memory and logic die that are difficult to burn in adequately; a newer joining technology not widely available to OEMs and contract assemblers; a poorly characterized joining process yield; and, due to the immaturity of the test, burn-in, and assembly; unclear ownership of defect liability. SOURCE: Robert Darveaux, Amkor Technology. These problems cannot be resolved by technologies or business models alone, he said. TSV processes can be standardized and characterized, with the resource-sharing model of consortia or the faster but potentially messy supply chain collaboration on specific projects.
2011 Conference Program
CTO Amkor Robert Darveaux is Corporate Technology Officer at Amkor Technology. Robert has 24 years experience in the IC packaging field at the Microelectronics Center of North Carolina, Motorola, and Amkor. Robert has a B.S. in Nuclear Engineering from Iowa State University and a Ph.D. in Materials Science and Engineering from North Carolina State University. His areas of expertise in IC packaging include thermal and mechanical simulation, materials characterization, failure analysis, and fatigue life prediction for solder joints. Robert has published over 75 technical papers and has 22 patents.
IMAPS - Corporate Bulletin
:: IMAPS Honors Amkor Technology Executive Dr. Robert Darveaux with William D. Ashman Achievement Award (full story )
IMAPS Honors Amkor Technology Executive Dr. Robert Darveaux with William D. Ashman Achievement Award Amkor Technology, Inc. announced that Dr. Robert Darveaux, its corporate vice president, technology and platform development, has been awarded the prestigious William D. Ashman Achievement Award for 2011 from The International Microelectronics And Packaging Society (IMAPS). Dr. Darveaux is being recognized for his achievements and leadership in thermal and mechanical simulation, materials characterization, failure analysis, and fatigue life prediction for solder joints for the electronics packaging industry. The William D. Ashman Achievement Award recognizes an individual who, in the opinion of the William D. Ashman Achievement Award Selection Committee, has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities to enhance the electronics packaging profession as a member. Recipients of this award automatically become Life Members and Fellows of IMAPS. "Dr. Darveaux is one of our industry's most talented and creative technology development executives, and we congratulate him on being selected for this prestigious award," said Ken Joyce, Amkor's president and chief executive officer. Dr. Darveaux has over 23 years of experience in the electronics packaging industry, including stints at the Microelectronics Center of North Carolina, Motorola, and Amkor. He has a B.S. in Nuclear Engineering from Iowa State University and a Ph.D. in Materials Science and Engineering from North Carolina State University. He has published over 70 technical papers, been awarded 20 patents, and has led the development of several major package technology platforms.