:: IMAPS Honors Amkor Technology Executive Dr. Robert Darveaux with William D. Ashman Achievement Award (full story )
IMAPS Honors Amkor Technology Executive Dr. Robert Darveaux with William D. Ashman Achievement Award
Amkor Technology, Inc. announced that Dr. Robert Darveaux, its corporate vice president, technology and platform development, has been awarded the prestigious William D. Ashman Achievement Award for 2011 from The International Microelectronics And Packaging Society (IMAPS).
is being recognized for his
achievements and leadership in thermal and mechanical simulation, materials characterization, failure analysis, and fatigue life prediction for solder joints for the electronics packaging industry.
The William D. Ashman Achievement Award recognizes an individual who, in the opinion of the William D. Ashman Achievement Award Selection Committee, has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities to enhance the electronics packaging profession as a member.
Recipients of this award automatically become Life Members and Fellows of IMAPS
"Dr. Darveaux is one of our industry's most talented and creative technology development executives, and we congratulate him on being selected for this prestigious award," said Ken Joyce, Amkor's president and chief executive officer.
Dr. Darveaux has over 23 years of experience in the electronics packaging industry, including stints at the Microelectronics Center of North Carolina, Motorola, and Amkor.
He has a B.S. in Nuclear Engineering from Iowa State University and a Ph.D. in Materials Science and Engineering from North Carolina State University.
He has published over 70 technical papers, been awarded 20 patents, and has led the development of several major package technology platforms.