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This profile was last updated on 2/6/15  and contains information from public web pages and contributions from the ZoomInfo community.

Dr. Robert Darveaux Sr.

Wrong Dr. Robert Darveaux Sr.?

Vice President

Local Address: Gilbert, Arizona, United States
Skyworks Solutions Inc
20 Sylvan Road 20 Sylvan Road
Woburn , Massachusetts 01801
United States

Company Description: Skyworks Solutions, Inc. (Skyworks) designs, manufactures and markets a range of analog and mixed signal semiconductors that enable wireless connectivity. Skyworks...   more

Employment History


  • Ph.D. , Materials Science and Engineering
    North Carolina State University
  • B.S. , Nuclear Engineering
    Iowa State University
30 Total References
Web References
IMAPS - Corporate Bulletin, 15 Nov 2011 [cached]
:: IMAPS Honors Amkor Technology Executive Dr. Robert Darveaux with William D. Ashman Achievement Award (full story )
IMAPS Honors Amkor Technology Executive Dr. Robert Darveaux with William D. Ashman Achievement Award
Amkor Technology, Inc. announced that Dr. Robert Darveaux, its corporate vice president, technology and platform development, has been awarded the prestigious William D. Ashman Achievement Award for 2011 from The International Microelectronics And Packaging Society (IMAPS). Dr. Darveaux is being recognized for his achievements and leadership in thermal and mechanical simulation, materials characterization, failure analysis, and fatigue life prediction for solder joints for the electronics packaging industry.
The William D. Ashman Achievement Award recognizes an individual who, in the opinion of the William D. Ashman Achievement Award Selection Committee, has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities to enhance the electronics packaging profession as a member. Recipients of this award automatically become Life Members and Fellows of IMAPS.
"Dr. Darveaux is one of our industry's most talented and creative technology development executives, and we congratulate him on being selected for this prestigious award," said Ken Joyce, Amkor's president and chief executive officer.
Dr. Darveaux has over 23 years of experience in the electronics packaging industry, including stints at the Microelectronics Center of North Carolina, Motorola, and Amkor. He has a B.S. in Nuclear Engineering from Iowa State University and a Ph.D. in Materials Science and Engineering from North Carolina State University. He has published over 70 technical papers, been awarded 20 patents, and has led the development of several major package technology platforms.
Semico: Press Releases, 27 Sept 2011 [cached]
Robert Darveaux, Ph.D., CTO of Amkor Technology
ECTC | IEEE Electronic Components and Technology Conference, 21 June 2006 [cached]
Robert Darveaux - Skyworks Solutions, Inc.
"We are pleased to be working ..., 29 Aug 2011 [cached]
"We are pleased to be working on these new initiatives with an important semiconductor foundry partner like GLOBALFOUNDRIES," said Dr. Robert Darveaux, Amkor's corporate vice president, technology and platform development.
A strong focus on packaging was ..., 1 April 2012 [cached]
A strong focus on packaging was also in evidence in 2011, with a session featuring John Waite (GLOBALFOUNDRIES), Raj Pendse (STATS ChipPAC), Robert Darveaux (Amkor), and Nick Yu (Qualcomm).
Robert Darveaux presented "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs."
Raj Pendse, VP of product and technology marketing at STATS ChipPAC and Robert Darveaux, CTO of Amkor, covered this supply chain integration from the dedicated packaging house perspective.
Darveaux spoke on "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs."
Darveaux compared the relative ease of sourcing, assembly, and test of package-on-package (POP) with the challenges of TSV: difficult to test high-density area array contact pads or bumps; bare or partially assembled memory and logic die that are difficult to burn in adequately; a newer joining technology not widely available to OEMs and contract assemblers; a poorly characterized joining process yield; and, due to the immaturity of the test, burn-in, and assembly; unclear ownership of defect liability.
SOURCE: Robert Darveaux, Amkor Technology.
These problems cannot be resolved by technologies or business models alone, he said. TSV processes can be standardized and characterized, with the resource-sharing model of consortia or the faster but potentially messy supply chain collaboration on specific projects.
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