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Skyworks Solutions Inc
20 Sylvan Road 20 Sylvan Road
Skyworks Solutions, Inc. (Skyworks) designs, manufactures and markets a range of analog and mixed signal semiconductors that enable wireless connectivity. Skyworks products include power amplifiers (PAs), front-end modules (FEMs) and integrated radio freq...
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(53 Total References)
ECTC | IEEE Electronic Components and Technology Conference
Robert Darveaux - Skyworks Solutions, Inc.
A strong focus on packaging was ...
A strong focus on packaging was also in evidence in 2011, with a session featuring John Waite (GLOBALFOUNDRIES), Raj Pendse (STATS ChipPAC), Robert Darveaux (Amkor), and Nick Yu (Qualcomm).
• Robert Darveaux
presented "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs."
Raj Pendse, VP of product and technology marketing at STATS ChipPAC and Robert Darveaux, CTO of Amkor, covered this supply chain integration from the dedicated packaging house perspective.
spoke on "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs."
compared the relative ease of sourcing, assembly, and test of package-on-package (POP) with the challenges of TSV: difficult to test high-density area array contact pads or bumps; bare or partially assembled memory and logic die that are difficult to burn in adequately; a newer joining technology not widely available to OEMs and contract assemblers; a poorly characterized joining process yield; and, due to the immaturity of the test, burn-in, and assembly; unclear ownership of defect liability.
SOURCE: Robert Darveaux, Amkor Technology.
These problems cannot be resolved by technologies or business models alone, he
TSV processes can be standardized and characterized, with the resource-sharing model of consortia or the faster but potentially messy supply chain collaboration on specific projects.
The second keynote address was focused ...
The second keynote address was focused on Flip Chip & Wafer Level Packaging, "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies" by Dr. Robert Darveaux, Senior Vice President of Technology & Platform Development of Amkor Technology, Inc.
He discussed device trends driving IC package development today, among the most prevalent are:
IMAPS - Think Thin 2011 ATW and Tabletop Exhibition
Robert Darveaux, Amkor
Session Chair: Robert Darveaux, Amkor Technology, Inc.
Materials Advances Enable Thinner Packages
Robert Darveaux, Amkor Technology, Inc.
2011 Conference Program
Robert Darveaux is Corporate Technology Officer at Amkor Technology.
has 24 years experience in the IC packaging field at the Microelectronics Center of North Carolina, Motorola, and Amkor
Robert has a B.S. in Nuclear Engineering from Iowa State University and a Ph.D. in Materials Science and Engineering from North Carolina State University.
areas of expertise in IC packaging include thermal and mechanical simulation, materials characterization, failure analysis, and fatigue life prediction for solder joints.
has published over 75 technical papers and has 22 patents.