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Wrong Robert Darveaux?

Dr. Robert Darveaux Sr.

Direct Phone: (949) ***-****       

Email: r***@***.com

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Skyworks Solutions Inc

20 Sylvan Rd.

Woburn, Massachusetts 01801

United States

Company Description

Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the automotive, broadban ... more

Find other employees at this company (2,841)

Background Information

Employment History

Corporate Vice President, Technology and Platform Development

Amkor Technology Inc

Vice President

Amkor Technology Inc

Associate Professor In the Electronic Systems Department

Arizona State University

Vice President of New Package Engineering

Unitive , Inc.

Position, Electronics Packaging Industry


Honors Amkor Technology Executive

International Microelectronics And Packaging Society



Nuclear Engineering

Iowa State University


Materials Science and Engineering

North Carolina State University

Web References (54 Total References)

ECTC | IEEE Electronic Components and Technology Conference [cached]

Robert Darveaux - Skyworks Solutions, Inc.

ECTC | IEEE Electronic Components and Technology Conference [cached]

Robert Darveaux - Skyworks Solutions, Inc.

A strong focus on packaging was ... [cached]

A strong focus on packaging was also in evidence in 2011, with a session featuring John Waite (GLOBALFOUNDRIES), Raj Pendse (STATS ChipPAC), Robert Darveaux (Amkor), and Nick Yu (Qualcomm).

Robert Darveaux presented "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs."
Raj Pendse, VP of product and technology marketing at STATS ChipPAC and Robert Darveaux, CTO of Amkor, covered this supply chain integration from the dedicated packaging house perspective.
Darveaux spoke on "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs."
Darveaux compared the relative ease of sourcing, assembly, and test of package-on-package (POP) with the challenges of TSV: difficult to test high-density area array contact pads or bumps; bare or partially assembled memory and logic die that are difficult to burn in adequately; a newer joining technology not widely available to OEMs and contract assemblers; a poorly characterized joining process yield; and, due to the immaturity of the test, burn-in, and assembly; unclear ownership of defect liability.
SOURCE: Robert Darveaux, Amkor Technology.
These problems cannot be resolved by technologies or business models alone, he said. TSV processes can be standardized and characterized, with the resource-sharing model of consortia or the faster but potentially messy supply chain collaboration on specific projects.

The second keynote address was focused ... [cached]

The second keynote address was focused on Flip Chip & Wafer Level Packaging, "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies" by Dr. Robert Darveaux, Senior Vice President of Technology & Platform Development of Amkor Technology, Inc. He discussed device trends driving IC package development today, among the most prevalent are:

2011 Conference Program [cached]

Robert Darveaux CTO Amkor

Robert Darveaux is Corporate Technology Officer at Amkor Technology. Robert has 24 years experience in the IC packaging field at the Microelectronics Center of North Carolina, Motorola, and Amkor. Robert has a B.S. in Nuclear Engineering from Iowa State University and a Ph.D. in Materials Science and Engineering from North Carolina State University. His areas of expertise in IC packaging include thermal and mechanical simulation, materials characterization, failure analysis, and fatigue life prediction for solder joints. Robert has published over 75 technical papers and has 22 patents.

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