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Wrong Robert Darveaux?

Robert Darveaux

Vice President

Skyworks Solutions Inc

HQ Phone:  (781) 376-3000

Direct Phone: (949) ***-****direct phone

Email: r***@***.com

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I agree to the Terms of Service and Privacy Policy. I understand that I will receive a subscription to ZoomInfo Community Edition at no charge in exchange for downloading and installing the ZoomInfo Contact Contributor utility which, among other features, involves sharing my business contacts as well as headers and signature blocks from emails that I receive.

Skyworks Solutions Inc

20 Sylvan Rd.

Woburn, Massachusetts,01801

United States

Company Description

Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the automotive, broadband, ce...more

Background Information

Employment History

Chief Technology Officer

Advanced Product Development


Associate Professor In the Electronic Systems Department

Arizona State University


Honors Amkor Technology Executive

International Microelectronics And Packaging Society


Vice President

Amkor Technology Inc


Web References(36 Total References)


ECTC | IEEE Electronic Components and Technology Conference

www.ectc.net [cached]

Robert Darveaux - Skyworks Solutions, Inc.


IMAPS - Corporate Bulletin

www.imaps.org [cached]

:: IMAPS Honors Amkor Technology Executive Dr. Robert Darveaux with William D. Ashman Achievement Award (full story )
IMAPS Honors Amkor Technology Executive Dr. Robert Darveaux with William D. Ashman Achievement Award Amkor Technology, Inc. announced that Dr. Robert Darveaux, its corporate vice president, technology and platform development, has been awarded the prestigious William D. Ashman Achievement Award for 2011 from The International Microelectronics And Packaging Society (IMAPS). Dr. Darveaux is being recognized for his achievements and leadership in thermal and mechanical simulation, materials characterization, failure analysis, and fatigue life prediction for solder joints for the electronics packaging industry. The William D. Ashman Achievement Award recognizes an individual who, in the opinion of the William D. Ashman Achievement Award Selection Committee, has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities to enhance the electronics packaging profession as a member. Recipients of this award automatically become Life Members and Fellows of IMAPS. "Dr. Darveaux is one of our industry's most talented and creative technology development executives, and we congratulate him on being selected for this prestigious award," said Ken Joyce, Amkor's president and chief executive officer. Dr. Darveaux has over 23 years of experience in the electronics packaging industry, including stints at the Microelectronics Center of North Carolina, Motorola, and Amkor. He has a B.S. in Nuclear Engineering from Iowa State University and a Ph.D. in Materials Science and Engineering from North Carolina State University. He has published over 70 technical papers, been awarded 20 patents, and has led the development of several major package technology platforms.


Semiconductor Packaging News - Exclusive: iMAPS Device Packaging Conference

www.semiconductorpackagingnews.com [cached]

The second keynote address was focused on Flip Chip & Wafer Level Packaging, "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies" by Dr. Robert Darveaux, Senior Vice President of Technology & Platform Development of Amkor Technology, Inc.
He discussed device trends driving IC package development today, among the most prevalent are:


IMAPS - International Conference and Exhibition on Device Packaging 2006

www.imaps.org [cached]

Chair: Robert Darveaux, Amkor Technology
Robert Darveaux, Miguel Jimarez, Amkor Technology


IMAPS - International Conference and Exhibition on Device Packaging 2009 (3D, Bio-Medical, Flip Chip, LEDs, MEMS, Wafer Level)

www.imaps.org [cached]

Hugh Roberts, Sven Lamprecht, Christian Sebald, Atotech; Mark Bachman, John Osenbach, Kishor Desai, LSI Corporation; Ron Huemoeller, YoonHa Jung, Robert Darveaux, Amkor Technology


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