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Wrong Mark Fissel?

Mark G. Fissel

Corporate Vice President,Global Products

Lam Research Corporation

HQ Phone:  (510) 572-0200

Direct Phone: (510) ***-****direct phone

Email: m***@***.com

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I agree to the Terms of Service and Privacy Policy. I understand that I will receive a subscription to ZoomInfo Community Edition at no charge in exchange for downloading and installing the ZoomInfo Contact Contributor utility which, among other features, involves sharing my business contacts as well as headers and signature blocks from emails that I receive.

Lam Research Corporation

4650 Cushing Parkway

Fremont, California,94538

United States

Company Description

Lam Research Corporation is a major supplier of wafer fabrication equipment and services to the worldwide semiconductor industry, where we have been advancing semiconductor manufacturing for more than 30 years. With the ongoing and growing demand for feature-r... more.

Find other employees at this company (7,764)

Background Information

Employment History

Vice President Corporate Marketing

Novellus Systems Inc


Vice President and General Manager of Integrated Metals Division

International Plastics & Equipment Corp


Web References(7 Total References)


Novellus Systems (NVLS) - Investorville

www.investorville.com [cached]

That prohibition has now expired, said Mark G. Fissel, general manager of the Novellus PVD and Electrofill Products group.He said he had no information on the pervasive reports about acquiring Lam.


MICRO:Industry News:Breakout (June '99)

www.micromagazine.com [cached]

Mark Fissel of Novellus expressed similar upbeat sentiments about the level of customer support.He reports "great interest" in the company's Sabre xT copper electrofill system."The improvements we put in the Sabre xT platform are basically what we've learned over the last year and a half of copper integration with the top 10 semiconductor manufacturers," says Fissel, who is the general manager, metals group, PVD and electrofill products."So, they're looking at this developmental experience we've pulled together in our second-generation plating system." CUTTING EDGE: Novellus has created new chemistries for its next-generation Sabre xT tool.Novellus has seen the greatest interest for the Sabre coming from chipmakers in the United States and Asia.With its first-generation tool launched in June 1998 already installed "at a lot of major manufacturers," Fissel says, "we still see our market share greater than 50%." Fissel sees a "general confidence" in particle performance specs for the Novellus system, but he notes parenthetically that commonly used defect detection tools have difficulty measuring copper contamination."They're just learning calibration curves for copper specifically," he maintains, adding that there's a question of whether "the particle is in the film or on the surface." Applied's Carl declines to quote a price for the Millennia, although both that system and the Novellus tool are reported to cost in the range of $2.5 million each.Carl says Applied is the first to market a closed-loop system, while Fissel believes the Sabre's Smart Dose technology and Shipley-based electrofill chemistry give it an edge. Fissel says he has even seen nibbles for the Novellus tool from some of the Asian foundries.


Cleanroom News

www.berkshire.com [cached]

"Three hundred millimeter has been later than what was originally anticipated by the industry," said Mark Fissel, vice president and general manager of the Integrated Metals division of another equipment maker at the show, Novellus Systems Inc., of San Jose, Calif. "But now there is a lot of momentum, not just with the equipment manufacturers but with the chip makers, too.


MICRO:Industry News:Breakout (June '99)

www.micromagazine.com [cached]

Mark Fissel of Novellus expressed similar upbeat sentiments about the level of customer support.He reports "great interest" in the company's Sabre xT copper electrofill system."The improvements we put in the Sabre xT platform are basically what we've learned over the last year and a half of copper integration with the top 10 semiconductor manufacturers," says Fissel, who is the general manager, metals group, PVD and electrofill products."So, they're looking at this developmental experience we've pulled together in our second-generation plating system." CUTTING EDGE: Novellus has created new chemistries for its next-generation Sabre xT tool.Novellus has seen the greatest interest for the Sabre coming from chipmakers in the United States and Asia.With its first-generation tool launched in June 1998 already installed "at a lot of major manufacturers," Fissel says, "we still see our market share greater than 50%." On April 7 Novellus unveiled the next-generation Sabre tool, followed a day later by Applied's official launch of the Millennia Electra electrochemical plating tool.Novellus claims the Sabre can produce copper interconnects with aspect ratios up to 10:1 and linewidths down to 0.13 µm.Based on the original Sabre platform, the system has the same cell design and footprint of its predecessor but delivers a higher throughput of up to 75 wafers/hr.A special kit enables users to change wafer sizes to accommodate both 200- and 300-mm substrates. Applied is selling the Millennia as one component in a copper interconnect toolset that also includes the company's Endura barrier and seed system and Mirra Electra CMP tool.Fissel sees a "general confidence" in particle performance specs for the Novellus system, but he notes parenthetically that commonly used defect detection tools have difficulty measuring copper contamination."They're just learning calibration curves for copper specifically," he maintains, adding that there's a question of whether "the particle is in the film or on the surface." Applied's Carl declines to quote a price for the Millennia, although both that system and the Novellus tool are reported to cost in the range of $2.5 million each.Carl says Applied is the first to market a closed-loop system, while Fissel believes the Sabre's Smart Dose technology and Shipley-based electrofill chemistry give it an edge. Fissel says he has even seen nibbles for the Novellus tool from some of the Asian foundries."A lot of the foundries are starting to get interested in copper earlier than anticipated.They see they're going to have to be competitive with logic, systems-on-a-chip, ASICs, and other processes that benefit from copper."MicroHome | Search | Current Issue | MicroArchivesBuyers Guide | Subscribe to MICRO


www.novellus.com

Improved wafer handling speed combined with reduced non-value-added-time result in breakthrough 100 wph throughput, leading to superior capital productivity,' said Mark G. Fissel, vice president and general manager of Novellus' Integrated Metals Division. 'Not only is this the industry's first PVD system to break the 100 wph barrier, but it also leverages our HCM technology, proven to deposit effective barrier/seed layers for copper dual damascene interconnect structures with an aspect ratio of 8:1 at the 0.10-micron node.


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