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This profile was last updated on 11/2/11  and contains information from public web pages and contributions from the ZoomInfo community.

Vice President Corporate Marketin...

Phone: (408) ***-****  HQ Phone
Novellus Systems Inc
4000 North First Street
San Jose , California 95134
United States

Company Description: Novellus Systems, Inc. develops, manufactures, sells and supports equipment used in the fabrication of integrated circuits, which are called chips or...   more
Background

Employment History

  • Vice President and General Manager of Integrated Metals Division
    Novellus Systems Inc
  • Vice President and General Manager
    Novellus' Integrated Metals Division.
  • General Manager, Metals Group
    PVD
7 Total References
Web References
Improved wafer handling speed combined ...
www.gasonics.com, 10 July 2000 [cached]
Improved wafer handling speed combined with reduced non-value-added-time result in breakthrough 100 wph throughput, leading to superior capital productivity," said Mark G. Fissel, vice president and general manager of Novellus' Integrated Metals Division.
Improved wafer handling speed combined ...
www.novellus.com, 10 July 2000 [cached]
Improved wafer handling speed combined with reduced non-value-added-time result in breakthrough 100 wph throughput, leading to superior capital productivity,' said Mark G. Fissel, vice president and general manager of Novellus' Integrated Metals Division. 'Not only is this the industry's first PVD system to break the 100 wph barrier, but it also leverages our HCM technology, proven to deposit effective barrier/seed layers for copper dual damascene interconnect structures with an aspect ratio of 8:1 at the 0.10-micron node.
MICRO:Industry News:Breakout (June '99)
www.micromagazine.com, 6 June 2004 [cached]
Mark Fissel of Novellus expressed similar upbeat sentiments about the level of customer support.He reports "great interest" in the company's Sabre xT copper electrofill system."The improvements we put in the Sabre xT platform are basically what we've learned over the last year and a half of copper integration with the top 10 semiconductor manufacturers," says Fissel, who is the general manager, metals group, PVD and electrofill products."So, they're looking at this developmental experience we've pulled together in our second-generation plating system."
CUTTING EDGE: Novellus has created new chemistries for its next-generation Sabre xT tool.
Novellus has seen the greatest interest for the Sabre coming from chipmakers in the United States and Asia.With its first-generation tool launched in June 1998 already installed "at a lot of major manufacturers," Fissel says, "we still see our market share greater than 50%."
...
Fissel sees a "general confidence" in particle performance specs for the Novellus system, but he notes parenthetically that commonly used defect detection tools have difficulty measuring copper contamination."They're just learning calibration curves for copper specifically," he maintains, adding that there's a question of whether "the particle is in the film or on the surface."
Applied's Carl declines to quote a price for the Millennia, although both that system and the Novellus tool are reported to cost in the range of $2.5 million each.Carl says Applied is the first to market a closed-loop system, while Fissel believes the Sabre's Smart Dose technology and Shipley-based electrofill chemistry give it an edge.
...
Fissel says he has even seen nibbles for the Novellus tool from some of the Asian foundries.
Improved wafer handling speed combined ...
www.sfamipec.com, 10 July 2000 [cached]
Improved wafer handling speed combined with reduced non-value-added-time result in breakthrough 100 wph throughput, leading to superior capital productivity," said Mark G. Fissel, vice president and general manager of Novellus' Integrated Metals Division."Not only is this the industry's first PVD system to break the 100 wph barrier, but it also leverages our HCM technology, proven to deposit effective barrier/seed layers for copper dual damascene interconnect structures with an aspect ratio of 8:1 at the 0.10-micron node.This enabling technology extends the useful life of production proven and cost effective PVD."
As device geometries move towards the 0.10-micron node, a continuous and fully integrated barrier/seed layer becomes critical to device performance.Barrier layers provide an effective block to preventing copper migration into the surrounding dielectric.The seed layer is essential to ensure void-free fill of high-aspect ratio structures, as well as good copper adhesion.
MICRO:Industry News:Breakout (June '99)
www.micromagazine.com, 7 July 2002 [cached]
Mark Fissel of Novellus expressed similar upbeat sentiments about the level of customer support.He reports "great interest" in the company's Sabre xT copper electrofill system."The improvements we put in the Sabre xT platform are basically what we've learned over the last year and a half of copper integration with the top 10 semiconductor manufacturers," says Fissel, who is the general manager, metals group, PVD and electrofill products."So, they're looking at this developmental experience we've pulled together in our second-generation plating system."
CUTTING EDGE: Novellus has created new chemistries for its next-generation Sabre xT tool.
Novellus has seen the greatest interest for the Sabre coming from chipmakers in the United States and Asia.With its first-generation tool launched in June 1998 already installed "at a lot of major manufacturers," Fissel says, "we still see our market share greater than 50%."
On April 7 Novellus unveiled the next-generation Sabre tool, followed a day later by Applied's official launch of the Millennia Electra electrochemical plating tool.Novellus claims the Sabre can produce copper interconnects with aspect ratios up to 10:1 and linewidths down to 0.13 µm.Based on the original Sabre platform, the system has the same cell design and footprint of its predecessor but delivers a higher throughput of up to 75 wafers/hr.A special kit enables users to change wafer sizes to accommodate both 200- and 300-mm substrates.
Applied is selling the Millennia as one component in a copper interconnect toolset that also includes the company's Endura barrier and seed system and Mirra Electra CMP tool.
...
Fissel sees a "general confidence" in particle performance specs for the Novellus system, but he notes parenthetically that commonly used defect detection tools have difficulty measuring copper contamination."They're just learning calibration curves for copper specifically," he maintains, adding that there's a question of whether "the particle is in the film or on the surface."
Applied's Carl declines to quote a price for the Millennia, although both that system and the Novellus tool are reported to cost in the range of $2.5 million each.Carl says Applied is the first to market a closed-loop system, while Fissel believes the Sabre's Smart Dose technology and Shipley-based electrofill chemistry give it an edge.
...
Fissel says he has even seen nibbles for the Novellus tool from some of the Asian foundries."A lot of the foundries are starting to get interested in copper earlier than anticipated.They see they're going to have to be competitive with logic, systems-on-a-chip, ASICs, and other processes that benefit from copper."
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