Dr. Joseph A. Abys
Vice President of Global R&D and Chief Technology Officer
Ethone Inc/ Cookson Electronics
Dr. Joseph A. Abys is the Vice President of Global Research & Development and Chief Technology Officer for Enthone Inc, Cookson Electronics.
He has been working in the field of electrodeposition for over 25 years.
interests have focused on the application of Nanotechnology and Self Assembled Manolayers in surface finishing.
Dr Abys joined AT&T Bell Labs in 1979 where he worked in the field of electrodeposition and chemical vapor deposition.
was promoted to head the electrodeposition department in 1987 which focused on electroronics finishing with emphasis on palladium. gold, nickel and tin electrodeposition.
The lead free movement in the 1990s saw his
organization investigate lead-free solder and the "whisker phemomena".
He also held positions as product manager, general manager and president of Electroplating Chemcials & Services which was a venture business of Lucent Technology.
He joined Cookson Electronics Enthone in 2002.
has been a frequent speaker ar various national and international conference and trade show, and won awards from The American Electroplaters and Surface Finishing Society
The international Institiute of Connector & Interconnection Technology.
American Electrochemical society.
Institiute of Metal Finishing Johnson Matthey Award, Circuit World and IPC-Apex best papers in 2002 and 2004 for work done in understanding whisker growth phenomenon.
Dr. Abys received a PhD degree in Inorganic Chemistry from Brown University in 1979 and BS degree in Chemistry from Marist college in 1975.
spent one year as an undergraduate research follow at Argonne National Laboratories in 1974-1975 working on one dimensional conductive materials.
holds over 35 patents pending and has co-authored over 100 technical publications.
is an author of three book chapters including "Palladium Electroplating
" & "Tin
Alloys for lead-free Solder" in Modern Electroplating.
He served on various committee most notably as chairman of the Electronics Finishing Committee of the American Electroplaters and Surface Finishing Society.