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[18.03.02] SUSS say new technology allows low-cost sub-micron lithography
Contact printing has always offered image quality and resolution when paired with the appropriate wavelength light source (DUV, i-line, g-line, broadband) and matching photoresist process. The availability of high quality sub-micron masks and damage caused by contact between the mask and wafer have prevented more wide-spread adoption.
Quality Today News - Karl Suss Offers Film Thickness Metrology Tool
We do that by solving problems, developing innovative technology, and bringing new ideas to market, ' explained James Hermanowski, international product manager for Suss's Coating Business. ``The KT-22 specifically addresses a market where no solution previously existed, thus eliminating another barrier in applications where thick resist processing is a requirement.''.
Microlithography World - Low-cost lithography for 300mm wafer packaging
Future Fab Intl.
Applications of Simulation Modeling at Texas Instruments DMOS5 Wafer Fab Future Fab Intl. Volume 15, July 11, 2003
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