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This profile was last updated on 1/18/03  and contains information from public web pages.

Dr. Cuong Van Pham

Wrong Dr. Cuong Van Pham?

Active Member

Semiconductor International
 
Background

Employment History

Education

  • Master's degree , Manufacturing and Industrial Engineering
    Wayne State University
  • Bachelor's degree , Mechanical Engineering
    University of Wisconsin , Madison
  • Ph.D. , Manufacturing and Industrial Engineering
    Wayne State University
Web References
Investors - Management
www.sempck.com, 18 Jan 2003 [cached]
Dr. Cuong Van Pham - Executive Vice President, Engineering, SEMX Microelectronic Packaging Group, Acting President SPM Division Dr. Pham joined SEMX in November 2000 as Group Vice President of Engineering.From 1986 to 2000 prior to joining SEMX, Dr. Pham was with Ford Motor Company's Visteon Group.He began his work at Ford as a Senior Engineer, moving up to Senior Technical Specialist for microelectronic interconnections.From 1985 to 1986, Dr. Pham was Senior Manager of the Advanced Technology Department at Sulzer Intermedics, where he introduced novel and innovative concepts and designs for multilayer ceramic packages.Dr. Pham began his career as a Development Engineer at AT&T Bell Laboratories where he spent seven years.
Dr. Pham is the inventor and holder of 19 US patents and 10 European patents in microelectronic packaging and bonding technology.He is an active member of several electronic associations, such as the International Electronic Packaging Society (IEPS), Semiconductor International (SEMI), and the American Society of Testing and Measurements (ASTM).Dr. Pham received his Ph.D. and Master's degree in Manufacturing and Industrial Engineering from Wayne State University and his Bachelor's degree in Mechanical Engineering from the University of Wisconsin, Madison.
1 Labriola CourtArmonk NY, 10504Phone: (914) 273-5500Fax: (914) 273 5860E-Mail: investorrelations@semx.com
Todays News
www.prnewswire.com, 6 Nov 2000 [cached]
ARMONK, N.Y., Nov. 6 /PRNewswire / -- The Materials Group of SEMX Corporation (Nasdaq : SEMX) (the Corporation) announced that Dr. Cuong Van Pham was appointed to the newly created position of Group Vice President of Engineering.Most recently, Dr. Pham served as Senior Technical Specialist in Microelectronic Interconnection at Ford Motor Company and Visteon Corporation, providing strategic direction and guidance.As the Senior Manager of Advanced Technology Department of Sulzer Intermedics, he introduced novel and innovative concepts and designs for multilayer ceramic packages and began his career as a Development Engineer at AT&T Bell Laboratories.
...
Dr. Pham, said, I am honored to have the opportunity to join SEMX at this very exciting time.
...
Dr. Pham has recently relocated his family to San Diego and will maintain his primary office in the SEMX Materials Group headquarters, located on Polese Company's new advanced manufacturing campus.
SEMX Corporation, through its Materials Group, manufactures specialty thermal management and interconnect products for broadband communications infrastructure in the Internet, fiber optic and wireless industries.Its products are key components in diverse industries and applications, including : high bandwidth wireless and fiber optic voice and data communication systems, Internet and intranet servers and routers, wireless base stations, automotive, medical and other microelectronic devices and systems.Through its Services Group, SEMX reclaims silicon test wafers for the semiconductor industry.
Investors - Management
www.amersil.com, 15 June 2002 [cached]
Dr. Cuong Van Pham - Executive Vice President, Engineering, SEMX Microelectronic Packaging Group, Acting President SPM Division Dr. Pham joined SEMX in November 2000 as Group Vice President of Engineering.From 1986 to 2000 prior to joining SEMX, Dr. Pham was with Ford Motor Company's Visteon Group.He began his work at Ford as a Senior Engineer, moving up to Senior Technical Specialist for microelectronic interconnections.From 1985 to 1986, Dr. Pham was Senior Manager of the Advanced Technology Department at Sulzer Intermedics, where he introduced novel and innovative concepts and designs for multilayer ceramic packages.Dr. Pham began his career as a Development Engineer at AT&T Bell Laboratories where he spent seven years.
Dr. Pham is the inventor and holder of 19 US patents and 10 European patents in microelectronic packaging and bonding technology.He is an active member of several electronic associations, such as the International Electronic Packaging Society (IEPS), Semiconductor International (SEMI), and the American Society of Testing and Measurements (ASTM).Dr. Pham received his Ph.D. and Master's degree in Manufacturing and Industrial Engineering from Wayne State University and his Bachelor's degree in Mechanical Engineering from the University of Wisconsin, Madison.
1 Labriola CourtArmonk NY, 10504Phone: (914) 273-5500Fax: (914) 273 5860E-Mail: investorrelations@semx.com
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